WIRING BOARD STRUCTURE
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United States of America Patent
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Issued Date -
Feb 26, 2015
app pub date -
Oct 25, 2013
filing date -
Aug 22, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wiring board structure adapted to carry a heat generating component is provided. The wiring board structure includes a core layer, an active cooler, a dielectric layer and a plurality of conductive vias. The core layer has a cavity penetrating through the core layer. The active cooler includes a cold surface and a hot surface. The active cooler is disposed in the cavity. The dielectric layer covers the core layer and fills a gap between the active cooler and the cavity. The heat-generating component is disposed on an outer surface of the dielectric layer. The conductive vias are disposed in the dielectric layer and connecting the cold surface and the outer surface to connect the heat-generating component and the active cooler. A wiring board structure having an active cooling via is also provided.
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