CMOS COMPATIBLE WAFER BONDING LAYER AND PROCESS
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United States of America Patent
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Issued Date -
Feb 19, 2015
app pub date -
Aug 14, 2014
filing date -
Aug 16, 2013
priority date (Note) -
Abandoned
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Abstract
A wafer bonding layer and a process for using the same for bonding wafers are presented. The wafer bonding process includes providing a first wafer, providing a second type wafer and providing a water bonding layer. The wafer bonding layer is provided separately on a contact surface layer of the first or second wafer as part of a CMOS compatible processing recipe.
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