PACKAGE DEVICE FOR MICROELECTROMECHANICAL INERTIAL SENSOR
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United States of America Patent
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Issued Date -
Feb 19, 2015
app pub date -
Aug 16, 2013
filing date -
Aug 16, 2013
priority date (Note) -
Abandoned
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Abstract
A package device for a microelectromechanical inertial sensor comprises a ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside; a microelectromechanical system (MEMS) chip mounted inside the upper accommodation of the ceramic substrate and electrically connected with the interconnect metal lines; a top cover arranged on the ceramic substrate and sealing the upper accommodation space; and an integrated circuit (IC) chip mounted inside the lower accommodation space and electrically connected with the interconnect metal lines. The present invention can improve the reliability of components, increase the yield and decrease the fabrication cost.
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