HEATING DEVICE STRUCTURE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150047821A1
SERIAL NO

13966658

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present relates to a heating device structure, which comprises a heat conducting member to mate with the heat dissipation fins of an electronic device. Thereby, during the packaging process of the electronic device, the effect of multi-point heating can be achieved by combining the heat conducting member and the fins. Accordingly, heating can be performed rapidly to reach the soldering temperature. Without the influence of the structure of heat dissipation fins, the heating process will not be performed at low efficiency.

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Patent Owner(s)

Patent OwnerAddress
ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCHNO 1000 WUNHUA RD JIAAN VILLAGE LONGTAN TOWNSHIP TAOYUAN COUNTY

International Classification(s)

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  • 2013 Application Filing Year
  • F28F Class
  • 823 Applications Filed
  • 676 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HONG, HWEN-FEN TAOYUAN COUNTY, TW 43 81
LEE, YUEH-MU TAOYUAN COUNTY, TW 18 13
LIANG, YI-PING TAOYUAN COUNTY, TW 12 6
SHIH, ZUN-HAO TAOYUAN COUNTY, TW 22 17
SHIN, HWA-YUH TAOYUAN COUNTY, TW 34 85

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Patent Citation Ranking

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  • F28F Class
  • 0 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges622454017621101 - 1011 - 2021 - 3031 - 4041 - 5061 - 7071 - 80020406080100120140160180200220240260

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