METHOD FOR APPLYING A TEMPORARY BONDING LAYER
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United States of America Patent
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Feb 19, 2015
app pub date -
Dec 16, 2013
filing date -
Dec 21, 2012
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Abstract
A method for applying a temporary bonding layer to a carrier wafer for temporary joining to a product wafer by fusion bonding or anodic bonding, said method comprising:
- applying a temporary bonding layer which is suitable for fusion bonding or anodic bonding to the carrier wafer andmodifying the temporary bonding layer during and/or after application such that the temporary connection of the temporary bonding layer can be broken.
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