METHOD FOR ANCHORING Sn POWDER ON ALUMINIUM SUBSTRATE AND ALUMINIUM ELECRTOCONDUCTIVE MEMBER
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United States of America Patent
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Issued Date -
Feb 12, 2015
app pub date -
Mar 19, 2013
filing date -
Mar 22, 2012
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Abandoned
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Abstract
Provided are: a method of anchoring Sn powder that allows a Sn coating layer exhibiting excellent adhesion property and excellent heat cycle property to be adhered to and deposited on a surface of an aluminum substrate by means of a cold spray process, which is low in device cost and is high in productivity; and an electrically-conductive aluminum member produced by the method. The method of anchoring Sn powder onto an aluminum substrate is a method of anchoring Sn powder onto a surface of an aluminum substrate including depositing and anchoring Sn powder to form a Sn coating layer on the surface of the aluminum substrate by means of a cold spray process, the method including spraying the Sn powder onto the aluminum substrate under spray conditions of an operating gas temperature of 60° C. or less, an operating gas pressure of 0.30 MPa or more, and a spray distance between a spray gun nozzle and the aluminum substrate of from 5 to 30 mm.
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