Reduced footprint substrate transport vacuum platform
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United States of America Patent
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Jun 25, 2019
Grant Date -
Feb 12, 2015
app pub date -
Aug 8, 2014
filing date -
Aug 9, 2013
priority date (Note) -
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Abstract
An apparatus has a vacuum transport chamber having first and second isolation valves coupled to first and second substrate processing locations, and third and fourth isolation valves coupled to a load lock. First and substrate transport vacuum robots are provided. The load lock is between the first and second substrate transport vacuum robots, and has an atmospheric isolation valve. The atmospheric isolation valve, the third and the fourth isolation valves are arranged in a spaced triangular relationship. The first substrate transport vacuum robot transports a processed substrate from the first processing location to the load lock and transports an unprocessed substrate from the load lock to the first processing location substantially simultaneously as the second substrate transport vacuum robot transports a different processed substrate from the second processing location to the load lock and transports a different unprocessed substrate from the load lock to the second processing location.
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