ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION
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United States of America Patent
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app pub date -
Oct 24, 2014
filing date -
Dec 17, 2010
priority date (Note) -
Abandoned
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Abstract
The present disclosure is directed to a microelectronic assembly that includes first and second microelectronic elements, signal leads, one or more jumper leads, and a dielectric element that has first and second apertures. The signal leads may be connected to one or more of the microelectronic elements and extend through the one or more of the first or second apertures to conductive elements on the dielectric element. The jumper leads may extend through the first aperture and be connected to a contact of the first microelectronic element. The one or more jumper leads may span over the second aperture and be connected to a conductive element on the dielectric element.
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