CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
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United States of America Patent
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Issued Date -
Feb 12, 2015
app pub date -
Dec 11, 2013
filing date -
Aug 9, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.
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