LED DIE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Feb 12, 2015
app pub date -
Aug 11, 2014
filing date -
Aug 12, 2013
priority date (Note) -
Abandoned
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Abstract
An LED die includes a substrate, a first buffer layer, a second buffer layer, a plurality of nanospheres, a first semiconductor layer, an active layer and a second semiconductor layer. The first buffer layer, the second buffer layer, the first semiconductor layer, the active layer and the second semiconductor layer are formed successively on the substrate. The substrate has a plurality of protrusions formed on a surface thereof. The nanospheres are located on the first buffer layer formed on the protrusions and covered by the second buffer layer. The present disclosure also provides a method of manufacturing an LED die.
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