PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF
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United States of America Patent
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Issued Date -
Feb 12, 2015
app pub date -
Nov 27, 2013
filing date -
Aug 8, 2013
priority date (Note) -
Abandoned
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Abstract
A printed circuit board and a preparation method thereof. The preparation method includes: making a first through hole in a core board including a metal layer; filling copper into the first through hole; forming a circuit pattern of the metal layer of the core board through an alkaline etching process; successively laminating a dielectric layer and a first copper foil on one side of the core board; making a second through hole opposite to and communicated with the first through hole, in the first copper foil; filling copper into the second through hole; and forming a circuit pattern of the first copper foil. The method for preparing the printed circuit board provided in the present invention can effectively reduce the preparation cost of the printed circuit board, greatly increase the yield of a product and further improve the universality of application.
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