Application of Dielectric Layer and Circuit Traces on Heat Sink
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United States of America Patent
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Issued Date -
Feb 12, 2015
app pub date -
Mar 20, 2013
filing date -
Mar 20, 2012
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Abandoned
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Abstract
A dielectric layer is directly applied onto the surface of a heat sink part. For example, the composition for making the dielectric layer may be made into a paste or ink and then printed as a paste or ink, or applied with some other equivalent method, such as a lamination technique. The electrical circuit traces are then printed in a similar fashion onto the dielectric layer in the required pattern for whatever circuitry is to be applied. That circuitry (e.g., circuit elements) is then attached to the electrical traces as needed for the particular application.
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