PERFORATED POLYMER FILMS HAVING IMPROVED TOLERANCE TO TENSILE STRESS
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United States of America Patent
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Issued Date -
Feb 5, 2015
app pub date -
Feb 11, 2013
filing date -
Mar 9, 2012
priority date (Note) -
Abandoned
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Abstract
The invention relates to a perforated polymer film with porosity P from 30% to 50% and with an arrangement of perforations which is characterized by the perforation shape, the ratio of the semiaxes of the perforations, the orientation of the perforations, and the regular arrangement of the perforations, where the longitudinal tensile stress that the polymer film withstands without breaking is greater than that for identical porosity and any other arrangement of perforations which differs in at least one feature.
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