Blends of liquid epoxy and solid phenoxy resins
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United States of America Patent
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Dec 29, 2020
Grant Date -
Feb 5, 2015
app pub date -
Jan 30, 2013
filing date -
Feb 6, 2012
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Abstract
This invention relates to epoxy resin formulations for preforms to be used in molding processes, especially resin transfer molding processes and to methods for preparing the performs. The epoxy formulation is based on liquid or solid epoxy resins blended, with medium to high molecular weight, phenoxy resins. These formulations are highly compatible with epoxy curable injection resins, and more over are reacted in the polymeric matrix, without reducing the glass transition temperature (Tg) of the cured composite material.
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