LIGHT EMITTING MODULE HAVING WAFER WITH INTEGRATED POWER SUPPLY DEVICE
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United States of America Patent
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Issued Date -
Feb 5, 2015
app pub date -
Aug 22, 2011
filing date -
Dec 29, 2010
priority date (Note) -
Abandoned
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Abstract
A light emitting module is disclosed. The light emitting module comprises a wafer having first and second surfaces; a light emitting diode chip disposed on the first surface of the wafer; a power supply device for supplying power to the light emitting diode chip; and a photoelectric conversion device for converting sunlight into electricity and providing it to the power supply device, wherein the power supply device is disposed on the second surface of the wafer.
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