CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Feb 5, 2015
app pub date -
Feb 28, 2013
filing date -
Mar 2, 2012
priority date (Note) -
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Abstract
A circuit board is described. The circuit board comprises a substrate (4), a set of contact pads (6) supported on the substrate and a plurality of discrete adhesive conductive regions disposed on the contact pads and the substrate such that at some adhesive conductive regions are disposed on and between two contact pads.
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