Fine Pitch stud POP Structure and Method
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United States of America Patent
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Issued Date -
Feb 5, 2015
app pub date -
Apr 15, 2014
filing date -
Jul 30, 2013
priority date (Note) -
Abandoned
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Abstract
A fine pitch stud POP structure and method is disclosed. The studs are made in bonding pads on the top surface of a lower substrate, which greatly increase the height of the interconnection such as solder balls. In addition, the lower substrate and the upper substrate are connected by reflowing two solder balls on them separately. The two features make the diameter of the bonding balls greatly reduce and further make the pitch between two bonding balls on the lower substrate or the upper substrate greatly reduce, and then the fine pitch POP is achieved.
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