Apparatus & method for treating substrate
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United States of America Patent
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Issued Date -
Feb 5, 2015
app pub date -
Aug 1, 2013
filing date -
Aug 1, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one process chamber or a plurality of process chambers having a treating space in which a reflow process with respect to the substrate is performed, a cleaning unit cleaning the substrate, and a substrate transfer module disposed between the load port and the substrate treating module. The substrate transfer module includes a transfer robot transferring the substrate among the load port, the substrate treating module, and the cleaning unit.
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