SOUND INSULATION MATERIAL
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United States of America Patent
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Issued Date -
Feb 5, 2015
app pub date -
Jul 3, 2013
filing date -
Jul 4, 2012
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Abstract
The performance of a sound insulation material in which chips are utilized is improved. The sound insulation material includes a chip layer containing many chips. The chip layer is covered with a coat, and the chip layer includes an unbreathable intermediate membrane layer dividing the chip layer into a plurality of layers.
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