CROSSLINKABLE HALOGEN-FREE RESIN COMPOSITION, CROSSLINKED MOLDED ARTICLE, INSULATED WIRE AND CABLE
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United States of America Patent
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Jan 29, 2015
app pub date -
Jul 9, 2014
filing date -
Jul 23, 2013
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A crosslinkable halogen-free resin composition includes a base polymer including at least one type of ethylene-vinyl acetate copolymer (EVA) and an acid-modified polyolefin resin having a glass-transition temperature (Tg) as measured by DSC of not more than −55° C. at a mass ratio of 70:30 to 99:1, and a metal hydroxide included in an amount of 100 to 250 parts by mass per 100 parts by mass of the base polymer. The at least one type of EVA has a melting temperature (Tm) as measured by DSC of not less than 70° C. The base polymer includes 25 to 50 mass % of a vinyl acetate (VA).
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