CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER
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United States of America Patent
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Jan 29, 2015
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Feb 28, 2013
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Jul 3, 2012
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Abstract
In a conductive film forming method using photo sintering, a conductive film having low electric resistance is easily formed. The conductive film forming method is a method in which a conductive film is formed using photo sintering. This method includes the steps of forming a layer made of a sintering promoter on a substrate, forming a liquid film made of a copper particulate dispersion on the layer of the sintering promoter, drying the liquid film to form a copper particulate layer, and subjecting the copper particulate layer to photo sintering. The sintering promoter is a compound which removes copper oxide from metallic copper. Thereby, the sintering promoter removes a surface oxide film of copper particulates in photo sintering.
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