Solder Paste
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 29, 2015
app pub date -
Dec 25, 2012
filing date -
Dec 26, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A solder paste which solves any nozzle clogging that suddenly occurs in a case of being used in a discharging method and which also realizes residue-free because flux is decomposed by heating during soldering. In the solder paste produced by mixing solder powders with the flux, the flux is flux containing polyalkyl-methacrylate of not less than 1.0 mass % and less than 2.0 mass % as methacrylate polymer of an amount such that it prevents the solder powders from being sedimented at ordinary temperature and it is decomposed or evaporated in the process of heating during the soldering, and containing stearic acid amide of not less than 5.0 mass % and less than 15.0 mass %, as viscosity modifier, wherein viscosity is 50 through 150 Pa·s. It is preferable that the content of flux in the solder paste is not less than 11 mass % and less than 13 mass %.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully