WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURE
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United States of America Patent
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app pub date -
May 19, 2014
filing date -
Jan 26, 2007
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Abandoned
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Abstract
A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.
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