ELECTROLESS COPPER PLATING SOLUTION
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United States of America Patent
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Issued Date -
Jan 22, 2015
app pub date -
Jul 18, 2014
filing date -
Jul 19, 2013
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Abstract
Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.
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