ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT CHIP PROVIDED WITH PROJECTING ELECTRICAL CONNECTION PADS
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United States of America Patent
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app pub date -
Jul 14, 2014
filing date -
Jul 18, 2013
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Abandoned
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Abstract
An electronic device includes an integrated circuit chip with an insulating passivation layer. An opening in the passivation layer uncovers a first region of an electrical contact. An electrical connection pad is formed to fill the opening by covering the first region and extend in projection in such a way as to cover a second region situated on the passivation layer surrounding the opening. The periphery of at least one of the first and second regions has an elongate or oblong shape. Centers of the opening and the pad are aligned with each other.
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