METALIZED PLASTIC HEADER APPARATUS AND METHODS OF MANUFACTURE AND USE
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United States of America Patent
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Issued Date -
Jan 22, 2015
app pub date -
Jul 18, 2014
filing date -
Jul 19, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A low cost and highly consistent metallized header electronic assembly. In one embodiment, a metallized header assembly having electronic circuitry as well as terminals manufactured from an LDS polymer is disclosed. The metallized header assembly also includes electronic component receiving cavities configured to house one or more wire-wound magnetic cores. The wire leads from the wire-wound magnetic cores are electrically coupled to the terminals on the metallized header assembly via a eutectic solder using well known soldering techniques such as hand soldering, solder dipping, resistance welding, and the like. Methods of manufacturing and using the aforementioned metallized header assembly are also disclosed.
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