Epoxy resin composition and semiconductor apparatus prepared using the same
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United States of America Patent
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Oct 6, 2015
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Jan 22, 2015
app pub date -
Jul 18, 2014
filing date -
Jul 19, 2013
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Abstract
An epoxy resin composition includes an inorganic filler, an epoxy resin, and a curing agent. The inorganic filler has an average particle diameter D50 from about 2 μm to about 10 μm, an average particle diameter D10 of about 3 μm or less, and an average particle diameter D90 from about 6 μm to about 15 μm. Inorganic filler particles having a particle diameter of about 25 μm or more constitute about 0.1 wt % or less of the inorganic filler.
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