SURFACE-MOUNTING SUBSTRATE
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United States of America Patent
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app pub date -
Oct 2, 2014
filing date -
May 11, 2012
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Abandoned
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Abstract
A surface mounting substrate for surface mounting an electronic part using a lead-free solder includes a joint portion of the substrate to which the electronic parts is joined; and a stress relaxation portion formed in a vicinity of the joint portion of the substrate.
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