SPACE-SAVING FLAT INTERCONNECTION
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United States of America Patent
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app pub date -
Feb 13, 2014
filing date -
Jul 12, 2013
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Abandoned
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Abstract
Apparatus, consisting of an integrated circuit (IC) die, and a circuit. The IC die includes a semiconductor substrate having a substrate plane face and a substrate edge, an imaging array formed on the substrate plane face, and a plurality of array pads mounted on the substrate plane face and connected to the imaging array. The circuit includes a circuit substrate having a circuit face and a circuit edge butted to the substrate edge, a plurality of circuit pads mounted on the circuit face, and a plurality of traces mounted on the circuit face and connected to the circuit pads. The apparatus further includes a plurality of connectors coupling the array pads to the circuit pads.
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