METHODS FOR PROVIDING AND DELIVERING AN ENVIRONMENTALLY SEALED CHIP
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
May 22, 2014
filing date -
Nov 13, 2009
priority date (Note) -
Abandoned
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Abstract
The invention provides methods relating methods for environmentally sealing, protecting, and providing analysis chips for processing and analysis. The analysis chips are bonded directly or indirectly to chip carriers which are held within the chambers of an environmental packaging strip. The chambers are sealed with a sealing film such that the chip carriers are extracted using a piercing tool and an extraction tool.
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