POLISHING APPARATUS
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Jul 8, 2014
filing date -
Jul 12, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A polishing apparatus which can remove slurry which has entered into a gap between an elastic membrane for pressing a substrate such as a wafer and a retaining ring is disclosed. The polishing apparatus includes a top ring which has an elastic membrane configured to form a pressure chamber for pressing the substrate against a polishing pad, and a retaining ring disposed around the elastic membrane and configured to press the polishing pad, a top ring rotating device configured to rotate the top ring about an axis of the top ring, and a cleaning brush configured to be brought into contact with a peripheral portion of a lower surface and an outer circumferential surface of the elastic membrane.
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