FILM-THICKNESS MEASURING APPARATUS, FILM-THICKNESS MEASURING METHOD, AND POLISHING APPARATUS HAVING THE FILM-THICKNESS MEASURING APPARATUS
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United States of America Patent
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Jan 15, 2015
app pub date -
Jul 9, 2014
filing date -
Jul 12, 2013
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Abstract
A film-thickness measuring apparatus and a film-thickness measuring method capable of improving an accuracy of the film-thickness measurement are disclosed. The film-thickness measuring apparatus includes a substrate stage configured to support a substrate horizontally, a rinsing water supply structure configured to supply rinsing water onto an entire surface of the substrate on the substrate stage, a film-thickness measuring head configured to transmit light to a measurement area of the surface of the substrate on the substrate stage, produce a spectrum of reflected light from the measurement area, and determine a film thickness of the substrate from the spectrum, and a fluid supply structure configured to form a flow of a gas on a path of the light and supply the flow of the gas onto the measurement area.
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