Hot melt adhesive containing a hydrogenated styrenic block copolymer and an ethylene vinyl acetate copolymer exhibiting low blocking force
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United States of America Patent
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Feb 27, 2024
Grant Date -
Jan 15, 2015
app pub date -
Jul 11, 2014
filing date -
Jul 11, 2013
priority date (Note) -
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Abstract
A hot melt adhesive composed of an ethylene vinyl acetate copolymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a liquid plasticizer. The preferred ethylene vinyl acetate copolymer has a vinyl acetate content between 8 and 28 percent by weight, and the preferred hydrogenated styrenic block copolymer is a styrene-ethylene-butylene-styrene having about 30% styrene content and essentially no diblock. The hot melt gives excellent peel strength when used as a construction adhesive for disposable nonwoven articles. It can also be formulated to exhibit very low bleed through and blocking characteristics when used on low basis weight nonwoven fabrics.
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