POLISHING METHOD AND POLISHING APPARATUS
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Jul 3, 2014
filing date -
Jul 8, 2013
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Abstract
A polishing method capable of preventing damage to a substrate is disclosed. The polishing method includes inspecting a periphery of a substrate for an abnormal portion, polishing the substrate if the abnormal portion is not detected, and not polishing the substrate if the abnormal portion is detected. The abnormal portion of the substrate may be an foreign matter, such as an adhesive, attached to the periphery of the substrate. After polishing of the substrate, the periphery of the substrate may be inspected again for an abnormal portion.
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