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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Jan 29, 2013
filing date -
Jan 31, 2012
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Abstract
A method of forming a graphene film (20) on one or more surfaces (10) of a copper-containing substrate (12) comprising the steps of: (i) heating a copper-containing substrate (12) defining one or more surfaces (10) to an exposure temperature; (ii) exposing the substrate (12) to a carbon-containing precursor gas at the exposure temperature for a predetermined period of time to dissolve carbon atoms into the substrate (12) and saturate the substrate (12) with carbon atoms; and (iii) cooling the substrate (12) so as to segregate the dissolved carbon atoms (16) from the substrate (12) to form a graphene film (20) on the or each surface (10) of the substrate (12); wherein the method further includes the step of selecting the copper-containing substrate (12) on the basis of its thickness to control the depth of the graphene film (20) formed on the or each surface (10) of the substrate (12) on cooling the substrate (12) so as to segregate the dissolved carbon atoms from the substrate (12).
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