METHOD FOR FORMING THIN FILM PATTERN

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United States of America Patent

SERIAL NO

14500767

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Abstract

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To provide a method for forming a thin film pattern 14 having a predetermined shape on a surface of a substrate 1 having an electrode formed in advance in a thin film pattern forming region, there are included the steps of: bringing a resin film 2, which transmits visible light, into close contact with the substrate 1; irradiating the thin film pattern forming region 11 on the substrate 1 with laser light L, thereby forming an opening pattern 21 having the same shape as the thin film pattern 14 in the film 2; forming the thin film pattern 14 in the thin film pattern forming region 11 on the substrate 1 through the opening pattern 21 of the film 2; and peeling off the film 2.

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Patent Owner(s)

Patent OwnerAddress
V TECHNOLOGY CO LTDKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AZIZ, Hany Maher Oakville, CA 8 63
KAJIYAMA, Koichi Yokohama-shi, JP 49 408
KAJIYAMA, Yoshitaka Waterloo, CA 17 78
KUDO, Syuji Yokohama-shi, JP 6 71
MIZUMURA, Michinobu Yokohama-shi, JP 113 613

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