METHOD FOR MANUFACTURING AN EMBEDDED PACKAGE AND STRUCTURE THEREOF
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Jul 10, 2014
filing date -
Jul 11, 2013
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing an embedded package comprises the steps of: coupling at least one first embedded body including at least one connection port with a first circuit substrate and packaging the first embedded body and the first circuit substrate to form a package; and exposing the connection port of the package on an outer side of the package for other electronic carriers to couple with. The invention can overcome the disadvantage of the conventional System in Package manufacturing process which integrally packages multiple ICs in a same package to result in discard of the entire package because of failure of a single IC. The method of the invention makes assembly simpler, expansion, test and replacement of IC components easier, and also can reduce manufacturing time and accumulated heat, lower the cost and improve yield rate.
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