MEMORY ASSEMBLY WITH PROCESSOR MATCHING PIN-OUT
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Jul 11, 2013
filing date -
Jul 11, 2013
priority date (Note) -
Abandoned
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Abstract
A memory device includes one or more memory semiconductor chips housed in a surface-mount semiconductor package and formed on a package substrate. The package substrate includes a two-dimensional array of package leads for connecting signals of the one or more memory semiconductor chips to an external system. The memory assembly has a package pin-out being a mirror image of a memory interface pin-out of a processor. In other embodiments, a circuit module includes a printed circuit board, a processor mounted on a first side of the printed circuit board and a memory assembly mounted on a second, opposite side of the printed circuit board. The memory assembly has a memory assembly pin-out that is a mirror image of the memory interface pin-out of the processor and the memory assembly is positioned in direct alignment with the memory interface pin-out of the processor.
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