HEAD STACK ASSEMBLY, HARD DISK DRIVE, AND METHOD OF CONNECTING A HEAD GIMBAL ASSEMBLY TO A FLEXIBLE PRINTED CIRCUIT ASSEMBLY IN A HEAD STACK ASSEMBLY
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Sep 10, 2013
filing date -
Jul 15, 2013
priority date (Note) -
Abandoned
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Abstract
A head stack assembly includes at least one head gimbal assembly and a flexible printed circuit assembly. A flexure tail of the head gimbal assembly includes a row of first bonding pads, a first dual stage actuator pad and a first dummy pad arranged at two sides of said row of first bonding pads, and the first dual stage actuator pad and the first dummy pad are connected together via a jumping lead. The flexible printed circuit assembly includes at least one row of second bonding pads, at least one second dual stage actuator pad and at least one second dummy pad arranged for connecting with the row of first bonding pads, the first dual stage actuator pad and the first dummy pad respectively. The connection way between the head gimbal assembly and the flexible printed circuit assembly is simple, thereby less cross talk is generated on the preamplifier.
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