ASSEMBLY FOR A MEMS ENVIRONMENTAL SENSOR DEVICE HAVING IMPROVED RESISTANCE, AND CORRESPONDING MANUFACTURING PROCESS
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Jul 9, 2014
filing date -
Jul 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Described herein is an assembly for a MEMS sensor device, which envisages: a first body made of semiconductor material, integrating a micromechanical detection structure at a first main face thereof; a cap element, set stacked on the first main face of the first body, above the micromechanical detection structure; and an adhesion structure set between the first body and the cap element, defining a gap in a position corresponding to the micromechanical detection structure. At least one first opening is defined through the adhesion structure in fluidic communication with the gap.
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International Classification(s)
- G01H:MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC....
- G01K:MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT;....
- G01L:MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL ....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- G01F:MEASURING VOLUME, VOLUME FLOW, MASS FLOW, OR LIQUI....
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