CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE CONDUCTIVE PASTE
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Mar 21, 2013
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Mar 29, 2012
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Abstract
The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or higher and an average particle size of 0.01 μm to 1.0 μm; and a coating layer made of gold covering at least part of the metal particles. The conductive paste according to the present invention can suppress the occurrence of defects such as voids in a bonded part when a semiconductor element or the like is die-bonded to a substrate.
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