WET PROCESSING APPARATUS AND PLATING APPARATUS

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United States of America Patent

APP PUB NO 20150013905A1
SERIAL NO

14326439

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wet processing apparatus, such as a plating apparatus, and an etching apparatus, is disclosed. A wet processing apparatus includes a substrate-holder advancing mechanism configured to elevate a movable support to raise a substrate holder until the substrate holder is separated from a fixed support, move the movable support together with the substrate holder by a predetermined distance toward a holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward a holder put-in position.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MUKAIYAMA, Yoshitaka Tokyo, JP 22 212
NAKAGAWA, Yoichi Tokyo, JP 97 1488
YAMAKAWA, Junitsu Tokyo, JP 16 77

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