HEAT TRANSFER CONTROL IN PECVD SYSTEMS
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United States of America Patent
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Jan 8, 2015
app pub date -
Dec 20, 2012
filing date -
Jan 4, 2012
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Abstract
The invention relates to a method for manufacturing thin films on substrates, the method comprising providing a deposition system, said system comprising an inner non-airtight enclosure for containing at least one substrate and an outer airtight chamber completely surrounding said enclosure, and providing at least one substrate in the inner non-airtight enclosure. The inner non-airtight enclosure is maintained at a pressure lower than the pressure within said outer airtight chamber, and a backfilling gas comprising at least hydrogen or helium is introduced into the outer airtight chamber volume.
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