PAD STRUCTURE AND PRINTED CIRCUIT BOARD AND MEMORY STORAGE DEVICE USING THE SAME
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United States of America Patent
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Issued Date -
Jan 8, 2015
app pub date -
Oct 18, 2013
filing date -
Jul 5, 2013
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Abstract
A pad structure for disposing an electronic component on a printed circuit board is provided. The pad structure includes a first pad and a plurality of second pads. The first pad is configured to couple to a terminal of the electronic component. Each of the second pads is configured to couple to another terminal of the electronic component. The first pad and the second pads are electrically independent to each other, and the second pads are electrically independent to each other. Besides, a printed circuit board and a memory storage device using the pad structure are also provided.
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