Device for dispensing and distributing flux-free solder on a substrate
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United States of America Patent
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Feb 13, 2018
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N/A
app pub date -
Jul 3, 2014
filing date -
Jul 8, 2013
priority date (Note) -
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Abstract
A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.
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