ALUMINUM CONDUCTOR PASTE FOR BACK SURFACE PASSIVATED CELLS WITH LOCALLY OPENED VIAS
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United States of America Patent
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Issued Date -
Jan 8, 2015
app pub date -
Jan 11, 2013
filing date -
Jan 16, 2012
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Abandoned
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Abstract
This invention relates an aluminum conductor paste formulation and its method of application on rear side passivated locally opened vias; dot or line geometry or combination thereof employing laser ablation or chemical etching methods. Such Back Surface Passivated Si-solar cells include dielectric layers of Al203, SiNx, Si02, SiC, α-Si, Si02/SiNx, Al203/SiNx, Si02/Al203/SiNx. The Al-conductor paste of this invention achieves; (i) non-degradation of passivation stack, (ii) defect free surfaces and void free vias, (iii) a strong and uniform Back Surface Field (BSF) layer within dot vias and line vias.
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