Methods of Forming Conductive Materials on Contact Pads
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United States of America Patent
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Issued Date -
Jan 1, 2015
app pub date -
Jun 27, 2013
filing date -
Jun 27, 2013
priority date (Note) -
Abandoned
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Abstract
Methods of forming conductive materials on contact pads for semiconductor devices and packages. Substrate is provided with contact pads formed thereon. Conductive material is formed over the contact pads by a depositing process followed by a heating process to alter the chemical properties of the conductive material. Optionally, a dispersing process may be incorporated. An interconnect structure can be mounted over the conductive material where the interconnect structure is attached to the conductive material without any active treatment to the conductive material after formation.
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