TITANIUM-NICKEL ALLOY THIN FILM, AND PREPARATION METHOD OF TITANIUM-NICKEL ALLOY THIN FILM USING MULTIPLE SPUTTERING METHOD
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United States of America Patent
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Jan 1, 2015
app pub date -
Aug 13, 2012
filing date -
Oct 28, 2011
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Abstract
In a Ti—Ni alloy thin film, Ti and Ni are mixed and deposited on a base material by putting a Ti target and an Ni target at a predetermined distance from each other in a co-sputtering apparatus and simultaneously sputtering the targets by applying different voltages. A method of fabricating a Ti—Ni alloy thin film using co-sputtering includes a target preparing step that prepares a Ti target, a Ni target and a base material, a target disposing step that puts the Ti target and the Ni target at a predetermined distance from each other in a co-sputtering apparatus, an apparatus setting step that sets work conditions of the co-sputtering apparatus, and a thin film depositing step that forms a Ti—Ni alloy thin film with Ti and Ni mixed on the base material by operating the co-sputtering apparatus.
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