SUPPORT ASSEMBLY FOR USE IN SEMICONDUCTOR MANUFACTURING TOOLS WITH A FUSIBLE BOND
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United States of America Patent
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Issued Date -
Jan 1, 2015
app pub date -
Jun 28, 2013
filing date -
Jun 28, 2013
priority date (Note) -
Abandoned
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Abstract
A support assembly includes a first functional element, a second functional element adjacent to the cooling plate, and an adhesive layer disposed between the cooling plate and the substrate. An intermediate layer is disposed between the cooling plate and the substrate. The intermediate layer has a melting temperature less than a temperature that the adhesive layer melts or decomposes at in order to provide for recycling of the support assemblycar.
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