DE-POP ON-DEVICE DECOUPLING FOR BGA
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United States of America Patent
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app pub date -
Sep 17, 2014
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Sep 13, 2011
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Abandoned
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Abstract
Embodiments of the invention place surface-mount devices such as decoupling capacitors, resistors or other devices directly on the underside of a ball grid array (BGA) electronic integrated circuit (EIC) package, in place of de-populated BGA pads.
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